Charged EVs | Heraeus Electronics introduces value environment friendly, extremely dependable Ag-free AMB resolution for prime powered electronics

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Sponsored by Heraeus Electronics

Lately, the demand for prime powered electronics has grown exponentially. With speedy development in electrical/hybrid autos, we’re seeing that extra electronics and energy modules are wanted to maintain up with demand. Nonetheless, EV/Hybrid autos should not the one purposes driving this elevated demand. Different main purposes, corresponding to rail traction, wind generators, photovoltaic inverters and motor drives are additionally driving the elevated demand. These purposes are extraordinarily demanding and are working at excessive voltage and excessive present densities that should address excessive temperatures and harsh circumstances. One of many key parts for a extremely dependable energy module is a particularly dependable steel ceramic substrate. Substrate supplies for these purposes will need to have excellent traits when it comes to electrical, thermal, insulation, and mechanical efficiency throughout operation. To have a dependable system in place you’ll want to have a appropriate interconnection and meeting supplies like solder paste, sinter paste, and wire bonding, to call a couple of. 

Resulting from value effectivity, Al2O3 based mostly steel ceramic substrates, like direct copper bonded substrates are sometimes used for energy module manufacturing. Though, it’s a cheaper resolution, it isn’t at all times one of the best for sure purposes, particularly for prime energy modules. Al2O3 based mostly ceramic substrates battle to harness the complete energy of large band hole semiconductors. On this occasion, a superior substrate is required. Silicon nitride (Si3N4) based mostly steel ceramic substrates have been used in recent times for energy module meeting. Its superior mechanical properties, corresponding to bending power, fracture toughness and thermal conductivity makes Si3N4 a lovely resolution for a extremely dependable, excessive energy density module base. At this time Si3N4 substrates are manufactured utilizing lively steel brazing (AMB) expertise, which makes use of Ag-filled and titanium containing brazing pastes. Treasured steel and complicated processing steps drive the costs up for AMB substrates making it a dearer choice. 

Charged EVs Heraeus Electronics introduces cost efficient highly reliable

Heraeus Electronics has developed an answer that solves the fee and efficiency roadblocks beforehand described. It’s a value environment friendly, extremely dependable Ag-free AMB copper bonding expertise for becoming a member of nitride-based ceramics with copper foils. The fabric was developed utilizing a way the place there isn’t any requirement for utilizing costly vacuum-based brazing and longer course of time. The product is known as: Condura®.extremely, a Si3N4 Ag free AMB substrate.

Key Options

  • Excellent reliability and processing (eg. Sintering, bonding, soldering…)
  • Price environment friendly Si3N4 steel ceramic substrate
  • Permits thick Cu layers
  • Thinner ceramics vs. AIN doable for equal thermal

resistance

  • Thermal conductivity of Si3N4 ceramic:

Condura®.extremely is a cost-efficient Ag free AMB bonding expertise for steel ceramic substrates which are appropriate for prime finish purposes. The price discount of Condura®.extremely is achieved through the use of a silver-free brazing expertise mixed with an environment friendly brazing course of.

 Under in Determine 1, it provides a take a look at the thermal shock efficiency of Condura®.extremely.

Charged EVs Heraeus Electronics introduces cost efficient highly reliable

SAM photos of 20 particular person Condura®.extremely take a look at layouts earlier than and after thermal shock checks (liquid to liquid -65 ° C to + 150 ° C). No main degradation is seen after 8000 cycles. The crimson coloration signifies the etched isolation groove which is a part of the take a look at structure. Within the occasion of delamination between copper and brazed steel attributable to thermal shock, the crimson coloration groove would broaden. This exhibits that Condura®.extremely qualifies to totally leverage the mechanical robustness of the Si3N4 ceramics in the same method because the Ag containing AMB expertise.

Heraeus Electronics reveals at PCIM Europe 10-12th Might 

Condura®.extremely will launch globally this 12 months at PCIM Europe. PCIM Europe is the main convention and exhibition for energy electronics, renewable vitality, and vitality administration, going down in Nuremberg from Might 10-12, 2022. Whereas on the present go to Heraeus Electronics in Corridor 6, Sales space 322 to talk with our staff about Condura®.extremely or a few of our different new options for interconnects and die connect. 

Be part of Heraeus Electronics Dwell on the e-mobility discussion board 

​On Tuesday Might 10th at 11:20am CEST Heraeus Electronics will provide a sneak peak at our mAgic® Copper Sinter Paste with a presentation titled “ How close to is copper sintering”. For extra data, please go to us on the present or attain out to your native account supervisor. 

On Wednesday Might 11th at 12:50pm CEST Heraeus Electronics current on the Condura® product household and the way Heraeus Electronics will meet rising buyer expectations on the reliability, thermal efficiency, lifetime and value of steel ceramic substrates. Additionally on this presentation a brand new addition to the Condura® product line can be unveiled. 

Extra data on Heraeus Electronics

PCIM Europe E-Mobility Discussion board

Sponsored by Heraeus Electronics


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